Silicon Packaging Architecture (f/m/d)

Updated: March 05, 2024 06:13 AM GMT

Full-time Job in Munich, Bavaria

Intel

Munich, Germany

Job Description
The candidate will focus on designing and optimizing package thermal solution, ensuring reliability and thermal performance meet product requirements. The candidate will conduct thermal analyses and simulations to evaluate advance packaging architecture such as 2.5D/3D packaging and proposal design solutions. The candidate will lead the development and implementation of thermal/mechanical requirements for diversified IA platforms through the collaboration with cross-functional teams for ensuring the alignment with project scope.Qualifications
• Proven experience at least 15 years in thermal and mechanical engineering in electronic packaging and focusing on 2.5D/3D packaging is preferred.
• In-depth knowledge of thermal analysis tools, simulation software, and proficiency in relevant programming languages.
• Good interpersonal communication skills; able to work productively and efficiently both as a team member and as an individual
• Creative, proactive and innovative... More Detail