Die Bond Technical Expert

Updated: May 26, 2024 11:22 PM GMT

Nexperia

Seremban, Negeri Sembilan

About the role

The Diebond Technical Expert is responsible to drive the diebond strategy in Nexperia BE

What you will do

To assure that Nexperia has the right capabilities, aligned with package R&D roadmap

To continuously drive improvements in capability and throughput together with the sites.

To create synergies between Nexperia’s BE sites and make sure best practices are shared across

To define the appropriate tooling design rules for the diebond area

What you will need

Degree holder in Engineering related disciplines. Preferably Mechanical, Mechatronic or Electrical engineering.

At least five (5) years of related working experiences in semiconductor manufacturing environment

Skillful on Die bond assembly processes. Experience with the main Diebond models in Semiconductor BE

Familiar with Six-sigma techniques, FMEA, DOE and statistics.

Statistical analysis & quality and problem-solving tools. E.g. DOE, SPC, FMEA, 8D and Minitab etc.

Able to work in international work... More Detail