Next-Generation Substrate Technology Pathfinding Engineer

Updated: March 26, 2024 08:15 PM GMT

Full-time Job in Tsukuba, Ibaraki

TSMC

Tsukuba, Ibaraki

As a Next-Generation Substrate Technology Pathfinding Engineer, you will lead the exploration and development of next-generation semiconductor package substrate technologies in collaboration with Japanese equipment and materials manufacturers. This role requires expertise in various specialized areas, including insulation materials, solder materials, wet and dry processes such as plating and sputtering, laser via processing, and glass substrate technology. Candidates with a proven track record in these areas will be highly preferred. A Master's degree or higher in a relevant field is required.

Role
• Lead the pathfinding efforts for next-generation semiconductor package substrate technologies, identifying key technical challenges and opportunities for innovation.
• Collaborate closely with Japanese equipment and materials manufacturers to leverage their expertise and resources in the development of advanced substrate technologies.
• Conduct research and development activities focused... More Detail