Packaging Substrate Development Engineer

TSMC

Tsukuba, Ibaraki

Role

Manage internal/external(customer) substrate test vehicle build, and execute substrate technology roadmap validation (DOE, process window validation and etc.)

Responsible for full lifecycle health of new tape outs (NTO) and new product introduction (NPI). Ensure substrate on-time delivery and its outgoing quality/ reliability.

Direct interface with suppliers by leading engineering/operational meetings to track all the project readiness vs. setting targets/timelines. Provide a recovery plan for lagging tasks.

Drive continuous process improvement and yield enhancement activities.

Collaborate with suppliers and internal material research group to define next-generation packaging substrate needs of new materials – build up dielectrics, solder resist…

Qualifications
• 5 years+ experience with packaging substrate industry
• Good data analytic capability (statistics, DOE)
• Proven records of technical program management and problem-solving
• Bac./Master/Ph.D. in Materials Science... More Detail

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